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[2013] [ij³ª´Ù] Ovivo»ç, »õ·Î¿î ¹° »ý»ê °øÁ¤ ÄÁ¼Ò½Ã¿ò Çù·Â´ÜÀå
À̸§ °ü¸®ÀÚ waterindustry@hanmail.net ÀÛ¼ºÀÏ 2013.08.07 Á¶È¸¼ö 798
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[ij³ª´Ù] Ovivo»ç, »õ·Î¿î ¹° »ý»ê °øÁ¤ ÄÁ¼Ò½Ã¿ò Çù·Â´ÜÀå

GLV ±×·ìÀÇ ÀÚȸ»çÀÌÀÚ ¼¼°èÀûÀÎ ¼öó¸® ¹× ÆÞÇÁ Àü¹® ±â¾÷ÀÎ Ovivo»ç°¡ ¼ÒÇü ±â¾÷µé°ú ÇÔ²² ±¸¼ºµÇ´Â ¹° »ý»ê Facility 450 ÄÁ¼Ò½Ã¿òÀÇ Çù·Â´ÜÀåÀ¸·Î ¼±Á¤µÇ¾ú´Ù.

F450CÀÇ ¼³¸³¿¡ °üÇÑ Äí¿À¸ð(Cuomo) ´º¿å ÁÖÁö»çÀÇ °ø½Ä ¹ßÇ¥¿¡ µû¸£¸é, Àü ¼¼°è 10°³ÀÇ ³ª³ëÀüÀÚ ¼³ºñ ±â¾÷µéÀÌ ´º¿å ½ºÅä´Ïºê·è ´ëÇб³(SUNY) ³ª³ë´ÜÀ§ °øÇдëÇÐ(CNSE)¿Í Çù·ÂÇÏ¿© 450mm ÄÄÇ»ÅÍ Ä¨À» ÀåÂøÇÑ ¼³ºñµéÀ» ¸ðµÎ µðÀÚÀÎ ¹× ½Ã°øÇÑ´Ù°í ÇÑ´Ù. ¿ÃÇØ 7¿ù 9ÀϺÎÅÍ 11ÀϱîÁö Ķ¸®Æ÷´Ï¾Æ »÷ÇÁ¶õ½Ã½ºÄÚ¿¡¼­ ¿­¸° ¹ÝµµÃ¼ »ê¾÷ Àü½Ã»ó´ãȸ SEMICON¿¡¼­ F450C ÄÁ¼Ò½Ã¾öÀº 450mm ¼öó¸® °øÁ¤À¸·ÎÀÇ ÀüȯÀ» À§ÇÑ ÀÎÇÁ¶ó ¹× ½Ã¼³Àû ¼Ö·ç¼ÇÀ» ³íÀÇÇÏ´Â ÀÚ¸®¿¡¼­ ù ¹ø° Åä·ÐÆгηΠ¼±Á¤µÈ ¹Ù ÀÖ´Ù.


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Ovivo recognized for collaborating to develop new water fab consortium

MONTREAL, CANADA, August 1, 2013 -- Ovivo, a business sector of GLV Inc. (GLV Group), an international technological company active in the water treatment and pulp and paper sectors, was recently recognized for collaborating with a small group of other companies to develop the water fab Facility 450 Consortium (F450C).

Following the formal announcement from New York's Governor Cuomo of the formation of the F450C, ten major nanoelectronics facility companies from around the world will collaborate at SUNY's College of Nanoscale Science and Engineering (CNSE) to design and build the 450mm computer chip fabrication facilities. At the semiconductor industry's annual SEMICON West tradeshow, which took place in San Francisco, Calif., on July 9-11, the F450C hosted its first public panel discussion about facility and infrastructure solutions for the transition to 450mm wafer fabrication.

Beyond the manufacturing hurdles that 450mm wafer processing brings, these wafer fabs present new challenges with respect to the design of the facilities, substrate handling, tool connection, chemical distribution, water and electrical systems, and many other areas. Where the G450C provides 450mm equipment and process technologies, the goal of the F450C is to develop facility and infrastructure solutions essential to the transition to 450mm wafer fabrication.

[Ãâó: Waterworld / 2013³â 8¿ù 1ÀÏ]
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